• IoT :12Layers
  • IoT :12Layers
  • Updatetime:2026-04-29
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Product Description

Product photo

层数 / layer:12层 (12L)
基材 / base material:FR4
完成板厚 / board thickness:2 .0mm 
表⾯处理 / surface:沉⾦ (ENIG)
最⼩BGA(micro BGA):0 .2mm 
最⼩线间距 / min trace space:3mil
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