About us
Process capability| No | Item |
Mass Production |
Sample |
| 1 | Layer | 1-12L | 1-18L |
| 2 | Finish board thickness | 0.40mm—3.20mm（16—126mil） | 0.40mm—4.0mm |
| 3 | Min trace width/space |
0.10mm/0.10mm (H oz)
0.13mm/0.13mm (1 oz) 0.17mm/0.17mm (2oz) 0.23mm/0.23mm (3 oz) 0.30mm/0.30mm (4 oz) |
0.075mm/0.075mm (H oz) |
| 4 | Base copper | IL (Hoz—4oz) OL (Hoz—4oz) |
IL (1/3oz—4oz) OL (1/3oz—6oz) |
| 5 | Drill capability | 0.20mm(8mil) | 0.15mm(6mil) |
| 6 | Hole wall thickness (single-point) | 35um | 35um |
| 7 | PTH tolerance | ±0.076mm(2mil) | ±0.05mm(2mil) |
| 8 | NPTH tolerance | ±0.05mm(2mil) | ±0.025mm(1mil) |
| 9 | Hole location tolerance |
±0.075mm(3mil) | ±0.05mm(2mil) |
| 10 | Outline size tolerance | ±0.1mm punching ±0.127mm routing |
±0.1mm(4mil) |
| 11 | Min SM bridge | 0.10mm(4mil) Green SM | 0.075mm(3mil) |
| 12 | Min SM thickness | 5um (circuit corner) | 8um (circuit corner) |
| 13 | Aspect ratio | 6:1 | 8:1 |
| 14 | Bow and twist | ≤0.75% | ≤0.50% |
| 15 | Plug hole capability | 0.20—0.60mm(8mil—24mil) | 0.20—0.60mm(8mil—24mil) |
| 16 | Impedance tolerance | ±10% | ±8% |
| 17 | Surface treatment | LF-HASL (Sn-Ni-Cu), OSP, Imm-Au, Imm-Ag, Imm-Tin | LF-HASL (Sn-Ni-Cu), OSP, Imm-Au, Imm-Ag, Imm-Tin |
| 18 | Core thickness | 0.1mm（include copper foil） | 0.1mm（exclusive copper foil） |
| 19 | Max size(inch) | 20*26 | 20*26 |
| 20 | Mechanical blind and buried vias |
0.2mm | 0.15mm |
